TE Connectivity Ltd (TEL) — Technical state
As of 2026-10-06 — re-computed nightly across the coverage universe. Closelooknet diary readings, not advice.
Trades +4.7% vs the 50-day and +2.7% vs the 200-day average, 12.8% below the 52-week high and +15.4% off the 52-week low. Computed from daily closes.
The moving-average stack
- vs 20-day+3.9%
- vs 50-day+4.7%
- vs 200-day+2.7%
- 52-week band12.8% off the high · +15.4% off the low
- Streak1 consecutive up session
- 50-day crossprice crossed up through the 50-day 11 sessions ago
- Stochastic%K 82.3 · %D 88 · bear cross
Continue: the TEL chart & overview · the signal board
FAQ · from the current data · as of 2026-10-06
Quick answers
What is the current Closelooknet signal on TEL?
Recovery attempt under the 200-day — Trades +4.7% vs the 50-day and +2.7% vs the 200-day average, 12.8% below the 52-week high and +15.4% off the 52-week low. Computed from daily closes. As of 2026-10-06; the signal board re-computes across the coverage universe nightly. A research diary reading, not advice.
Is TEL above its 50-day and 200-day moving averages?
As of 2026-10-06, TE Connectivity Ltd trades +4.7% above its 50-day and +2.7% above its 200-day average, with the 20-day +3.9% away.
How far is TEL from its 52-week high?
12.8% below the 52-week high and 15.4% above the 52-week low, as of 2026-10-06.
Mentioned on Closelooknet
Where TEL appears in the diary — 5 pieces, newest first. Every link is our own writing.
Go deeper
Long reads
- Where to Invest in the AI Chip Constraint Chain
Tokyo Electron 8035.T · ¥40,600 Constructive Constraint: 88% global coater/developer market, no substitute TEL is the Japan-listed equivalent of ASML in its niche — every fab needs its coater/developer systems.
- Who Owns the AI Chip Buildout?
Japan The Invisible Upstream Monopolist Photoresist processing 96% → ~90% EUV mask blanks 91% → ~85% Silicon wafers 53% → ~50% Coater/developers 88% → ~85% Rapidus 2nm Pilot 2025, target production 2027 Govt semiconductor budget ¥10T…
- Nvidia Ecosystem — Wave 1: The ‘Stacking’ Peak
TEL's etch and deposition tools create the through-silicon vias (TSVs) and bonding surfaces that make HBM4 stacking possible.
101 and glossary
- Non-US Tech: The Widest Valuation Gap in a Decade
Key Companies ASML ★ Sentinel ASML Monopoly — 30x P/E vs NVIDIA 50x+ ADVT ★ Sentinel Advantest Testing monopoly — mid-teens P/E BESI BE Semiconductor Hybrid bonding leader — discount to peers TEL Tokyo Electron Deposition/etch — discount…
Dailies
- Tokyo reversed the silent selling overnight — Seoul joined, then faded at the close
watch the Asian names inside the Rubin build-out; the weekly's watchlist (SoftBank, Advantest, TEL, Hynix, Samsung, TSMC) is the scoreboard.
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